Tata Electronics sends hundreds to Taiwan for training ahead of India’s first AI-enabled fab: Report
New Delhi: Tata Electronics is accelerating its semiconductor ambitions by sending hundreds of employees to Taiwan for training as groundwork intensifies for its ₹91,000 crore fabrication (fab) unit in Dholera and ₹27,000 crore OSAT (outsourced semiconductor assembly and test) facility in Assam, sources told ET.
The company has partnered with Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC), which is providing hands-on training in specialised semiconductor skills.
“The number of trainees going to Taiwan has risen as the fab project nears execution,” one of the sources said, adding, “Talent is the biggest gap.”
PSMC is training small batches of 50–75 people at a time due to capacity constraints.
The training is structured around different functional areas, such as equipment handling, yield engineering, process technology, and quality assurance — each with tailored batch sizes based on need.
Tata is onboarding both fresh graduates and industry professionals with a few years of experience, preparing them to operate complex semiconductor manufacturing systems. “It’s a very methodical, thoughtful process,” said one of the people quoted.
Once operational, the Dholera fab is expected to create over 20,000 skilled jobs, while the OSAT facility in Assam will generate around 27,000 jobs, directly and indirectly.
At the groundbreaking event in March 2024, Union IT Minister Ashwini Vaishnaw said the first chip from the Dholera plant would roll out by December 2026, while Assam's OSAT unit would go live in mid-2025.
Tata Electronics is also strengthening leadership by hiring senior talent from global chip giants.
It recently appointed Tim McIntosh, formerly with Intel for 34 years, as VP and head of operations at Tata Semiconductor Assembly and Test (TSAT).
CEO Randhir Thakur and Asia president KC Ang also came from Intel and GlobalFoundries, respectively.
In a move to gain operational know-how, Tata is reportedly exploring the acquisition of a chip plant in Malaysia.
As per its deal with PSMC, the Taiwanese firm will support fab design, construction, and technology transfer, while also licensing a wide technology portfolio. The facility will be equipped to produce up to 50,000 wafers a month and will leverage AI, data analytics, and machine learning for next-gen factory automation and efficiency.
The fab will manufacture a range of chips — from power management ICs and microcontrollers to display drivers and logic chips for AI, automotive, computing, storage, and wireless communication markets.
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